Supplier and Process Quality Audit for Semiconductor Packaging and Testing: Multi-turn Dialogue and Prompt Engineering

Daily documents for this category include packaging process cards, bonding and molding parameters, wafer incoming material maps, test program

What the Data for This Category Looks Like

Daily documents for this category include packaging process cards, bonding and molding parameters, wafer incoming material maps, test program versions, yield reports, and failure analysis reports. Data sources cover wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM inspection equipment, and customer specification requirements. Update frequency varies with batch production, single-chip testing, and daily process inspections. Fields include batch identifiers, process temperature and pressure parameters, test bin codes, failure types, and more. Units include degrees Celsius, Pascals, volts, and other standard units.

Constraints on Multi-turn Dialogue and Prompt Engineering

Diverse data sources spanning the entire production process require multi-turn dialogue to gradually align core batch identifiers, preventing cross-batch incorrect data calls. High update frequency requires dialogue contexts to retain the latest process parameters and test results, avoiding references to outdated batch information. Multiple document types including process parameters and test reports require prompt engineering to clearly distinguish field priorities across document types, ensuring the large model accurately matches corresponding data. Severe consequences such as mixed batches and packaging failures require adding verification steps in multi-turn dialogue to confirm aligned information is correct.

Configuration Settings

This configuration is based on FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
Maximum Context Length8000–12000 tokenCovers the total character count of a single batch's packaging process card, test program version, and yield report
Variable BindingBind batch numbers and test program versions from variablesAccurately associate exclusive data for the current audit batch to avoid cross-batch incorrect data calls
Dialogue History ManagementBind single-batch audit sessions by chatIdIsolate dialogue contexts across different batches to ensure information for each audit round is independent
Prompt TemplateFixed to include three stages: batch verification, parameter alignment, failure analysisMatches the standard process of packaging and testing audits, guiding the large model to output results per business logic
Model Call Timeout600 secondsAdapts to the result return cycle of ATE test machines and X-ray scans
Knowledge Base Retrieval CountTop 3–5 entriesAvoids redundant data interfering with the large model's extraction of core audit information

Three Common Misconfigurations

  • Phenomenon: A connection error prompt appears after submitting a third-party model, and the error persists after enabling a proxy. Cause: The API gateway address and secret key for the third-party model were not correctly filled in the FastGPT v4.17.0 model configuration page.
  • Phenomenon: The guest login dialogue icon cannot be modified. Cause: A custom icon file that meets format requirements and is no larger than 2 MB was not uploaded in the global dialogue settings.
  • Phenomenon: Wafer test maps returned by the knowledge base cannot be displayed in dialogue. Cause: The prompt did not explicitly require converting image links to standard Markdown format, causing the large model to only return plain text links.

How to Verify Successful Configuration

  • Initiate a single-batch supplier audit dialogue, check if the messages field of the dialogue includes the current batch's wafer incoming material map number and test program version.
  • Enter bonding process parameters, verify if the returned results automatically match the corresponding fields in the batch's packaging process card.
  • Trigger a model connection test, confirm no connection error-related errors are displayed.
  • Enter questions related to failure analysis, verify that returned results are associated with the batch's failure analysis report data.

The values provided here are common starting points and should be evaluated against the reader's own samples.