What the data for this category looks like
Data sources for this category include wafer test maps, MES systems, bonding and molding equipment, ATE testers, X-ray/SAM inspection equipment, and customer specification documents. Data update frequencies cover per batch, per unit test, and daily. Daily documents include packaging process cards, bonding and molding parameters, wafer incoming material maps, test program versions, yield reports, and failure analysis reports. Data fields include batch number, bonding pull force value, molding temperature, test bin code, yield value, and more. Units include degrees Celsius, Newtons, string identifiers, and more. Data must be stored in association with batches and test nodes.
What constraints these characteristics impose on the workflow orchestration link
Multi-source heterogeneous data sources require workflows to configure multi-node data docking links to adapt to output formats of different devices and systems. High-frequency updated batch and unit test data requires workflows to support real-time triggering and variable binding at batch granularity, to avoid cross-batch data confusion. Diverse document types and associated fields require workflow knowledge base configurations to divide chunking rules by document type, retaining core associated information such as batches and parameters. Strict error consequences require workflows to add a pre-check link to automatically verify batch matching and parameter compliance, preventing defective products from flowing to downstream links.
How to set configurations
| Configuration Item | Recommended Practice | Rationale |
|---|---|---|
variables | Bind variables for the current batch's wafer incoming material map and test program version | This category requires matching exclusive documents by batch. The variables configuration enables precise association between variables and batches |
nodeId | 24-digit hexadecimal character unique node identifier | The system requires workflow nodes to use nodeId for unique identification, ensuring correct call paths |
| Timeout threshold | 600 seconds | ATE test single-batch data processing usually takes several minutes. This threshold covers conventional processing time |
| Document chunking rule | Chunk by test program version and batch number, with chunk length 800–1200 characters | Documents in this category contain parameter and batch association information. Chunking must retain core associated fields to avoid information fragmentation |
| Failure retry count | 3 times, 30-second interval | Occasional device communication exceptions are common in this scenario. This configuration reduces workflow interruptions caused by temporary exceptions |
| Global variable permission | Enable reference permission for specified batch variables | Restrict cross-batch data leakage, only allowing invocation of batch variables bound to the current workflow |
Three Common Misconfigurations
variablesreferences have no optional values. The interface dropdown is empty and cannot select preset variables. The cause is failure to enable reference permission for corresponding batch variables, or failure to bind exclusive document variables for this category in thevariablesconfiguration.- Workflow calls return axioserror, with the console showing a network request failure error. The cause is failure to use a 24-digit hexadecimal character
nodeId, or the workflow ID format does not meet system requirements. - Cross-batch data matching errors occur after workflow execution. Yield reports contain test data from other batches. The cause is failure to bind the current batch's wafer incoming material map variable via the
variablesconfiguration, leading to reference of documents from incorrect batches.
How to Confirm Configuration is Correct
- Open the FastGPT v4.17.0 workflow
variablesconfiguration panel, and check if preset variables such as packaging process cards and test program versions are listed. - Copy the workflow's
nodeId, and verify it is a valid 24-digit hexadecimal character format using a hexadecimal character verification tool. - Trigger a simulated batch workflow execution, and check if the node log correctly loads the current batch's wafer incoming material map data.
- Simulate a device communication exception scenario, and check if the workflow executes automatic retries according to the configured retry rules without direct interruption.
The values provided are common starting points and should be measured against the reader's own samples.