Supplier and Process Quality Audit for Semiconductor Packaging and Testing: Deployment and Upgrade

Data for this category is generated across the full packaging and testing workflow. Daily documents include packaging process cards, bonding and

What Data for This Category Looks Like

Data for this category is generated across the full packaging and testing workflow. Daily documents include packaging process cards, bonding and molding parameters, wafer incoming inspection maps, test program versions, yield reports, and failure analysis reports. Data sources include wafer test maps, factory MES systems, bonding and molding equipment logs, ATE tester data, X-ray/SAM inspection results, and customer specification requirements. Data is updated in sync with production batches, individual chip test results, and daily frequencies. Fields include batch numbers, parameter thresholds, test bin values, failure types, and more. There is no fixed unified format, and it adjusts based on equipment and production workflows.

Constraints Imposed on Deployment and Upgrade

The multi-source heterogeneous data sources, high-frequency update rhythm, and specialized document formats of this category create multiple constraints for deployment and upgrade. Non-standard data formats output by multiple devices require support for custom data source access and field mapping configurations during deployment, to adapt to industrial data of different structures such as wafer test maps and ATE test data. High-frequency updates per batch, individual test, and daily basis require sufficient database connection and storage resources to be configured during deployment, to avoid data write delays. Structured parsing requirements for specialized industrial documents such as packaging process cards require preset document parsing rules during the deployment phase, to adapt to specialized terminology and parameter formats.

How to Configure Settings

The following configurations are formulated based on FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
DB_MAX_LINK100–150Adapts to daily high-frequency test data writes and queries, to avoid database connection exhaustion
MONGODB_URImongodb://{user}:{pass}@{host}:{port}/fastgpt_sealStores unstructured industrial data such as batches and yield reports, matching business data storage requirements
REDIS_URLredis://:{pass}@{host}:{port}/0Caches real-time test bin data and session information, reducing database query delays
STORAGE_S3_ENDPOINThttp://192.168.1.100:9000Stores large-volume industrial documents such as wafer incoming inspection maps and X-ray/SAM inspection images, adapting to local or private cloud storage scenarios
FE_DOMAINhttps://seal-qc.your-domain.comConfigures the frontend access domain name, matching the access rules of the factory's internal office network
FILE_TOKEN_KEYSet based on actual measurementsGenerates file access tokens, controlling access permissions for sensitive documents such as packaging process cards

Three Common Misconfigurations

  • The conversation interface becomes unresponsive for long periods after deployment, with a 504 timeout status code. Cause: The DB_MAX_LINK configuration is not adjusted for high-frequency industrial data, leading to request blocking due to exhausted database connection pools.
  • Local debugging works normally, but the Docker image cannot connect to the database after startup. Cause: Database connection parameters such as MONGODB_URI are not injected as environment variables during image construction, leading to inconsistent configurations between the image and the local debugging environment.
  • Industrial document parsing dependencies cannot be loaded in offline deployment scenarios. Cause: Offline model packages required for specialized document parsing are not pre-downloaded during the deployment phase, leading to failures when parsing documents such as packaging process cards.

How to Verify Proper Configuration

  • Run a database connection test script to verify that configuration items such as MONGODB_URI and PG_URL can establish normal connections, and check whether the number of connections falls within the preset DB_MAX_LINK range.
  • Upload a packaging process card document to verify that the frontend interface can load and parse it normally, and check whether the access token generated by FILE_TOKEN_KEY can correctly authorize access.
  • Simulate a write request for individual chip test data, check whether the data can be synchronized to the storage system, and verify that the caching function of REDIS_URL works normally.
  • Access the domain name configured in FE_DOMAIN, check whether the frontend page loads normally, and confirm that the network access rules adapt to the factory's internal office environment.

The values provided are common starting points and should be evaluated against appropriate operational samples.