What this category of data looks like
Semiconductor packaging and testing data includes documents such as packaging process cards, bonding and molding parameters, wafer incoming material maps, test program versions, yield reports, and failure analysis reports. Data sources include wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM testing equipment, and customer specification requirements. Data update frequencies cover per-batch production, per-chip testing, and daily summaries. Fields include batch number, equipment number, test bin value, failure location, and more. Some parameters have fixed units: for example, bonding pressure is measured in newtons, and molding temperature is measured in degrees Celsius.
What constraints these characteristics impose on the source citation and traceability workflow
Multi-source and heterogeneous data sources require the traceability link to accurately distinguish field formats across different systems, to avoid confusing batch numbers from wafer test maps with batch numbers from MES systems. High-frequency updated data requires traceability calls to support real-time pulling of the latest ATE test results or yield data, to prevent referencing expired production parameters. Structural differences across multiple document types require configuring different recall rules during traceability; for example, failure analysis reports must be associated with bonding parameters for the corresponding batch. At the same time, test data for each chip must be bound to a unique identifier, to ensure that the complete production chain of a single chip can be traced when drafting exception reports.
How to configure the settings
This configuration is based on FastGPT v4.17.0.
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
quoteMaxToken | 1500–2000 token | Adapts to the content length of long documents such as packaging process cards and failure analysis reports, to avoid truncating critical traceability information |
| Source filtering rules | Classify by equipment type and system name | Distinguishes data from ATE test machines and MES systems, to avoid cross-source field confusion |
responseData | Only return entries matching the current batch number | Ensures traceability results are strictly bound to the current production batch, to prevent referencing parameters from other batches |
| Single search limit | Top 6 entries | Controls context length, to avoid excessive low-relevance data interfering with exception report drafting |
detail | Enable full field return | Extracts detailed fields such as failure location and bonding pressure, for detailed descriptions in exception reports |
| Variable reference binding | Associate batch number variables from form nodes | Enables dynamic triggering of traceability, to adapt to personalized requirements for each production batch |
Three common configuration mistakes
- Phenomenon: No optional values are displayed in the interface when referencing variables, and the batch number parameter cannot be called. Cause: The batch number variable was not predefined in the form input node or context node, causing the search link to fail to recognize the configured variable parameters.
- Phenomenon: Traceability data in the generated exception report does not match the current production batch, and cross-batch referencing occurs. Cause: No batch filtering rule was configured for
responseData, causing test data from other batches to be recalled. - Phenomenon: A timeout error occurs after triggering a traceability request. Cause: The
quoteMaxTokensetting exceeds the system's carrying limit, causing the context to load for too long and the request to time out.
How to confirm the configuration is complete
- View the FastGPT reference log to confirm that each traceability data entry is labeled with the source system or equipment name, such as ATE test machine or MES system.
- Trigger the exception report drafting process, and check whether the generated document includes the traceability links for the corresponding batch's test program version and wafer incoming material map.
- Manually modify the batch number variable to verify whether the traceability results automatically update to the production data for the corresponding batch.
- View the context panel to confirm that the number of referenced tokens does not exceed the
quoteMaxTokensetting value.
The values provided here are common starting points and should be measured against the reader's own samples.