Process Document and Exception Report Drafting for Semiconductor Packaging and Testing: Deployment and Upgrade

Data for this category covers the full packaging flow and testing links. Daily documents include packaging process cards, bonding and molding

What data for this category looks like

Data for this category covers the full packaging flow and testing links. Daily documents include packaging process cards, bonding and molding parameters, wafer incoming material drawings, test program versions, yield reports, and failure analysis reports. Data sources include wafer test charts, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM inspection equipment, and customer specification requirements. Update frequency adjusts based on production batches, single-chip test results, and daily production progress. Each document includes unique fields such as wafer number, parameter thresholds, test bin values, and failure types. There is no universal standardized format for these documents.

Constraints during deployment and upgrade

Multi-source heterogeneous data sources require support for multiple document and device data formats during deployment. A single parsing template cannot meet requirements. The high-frequency update rhythm requires configured storage and synchronization mechanisms to adapt to real-time or near-real-time data flow. This prevents data lag from affecting process document accuracy. Unique fields and non-standardized document structures require the knowledge base to support custom field mapping. Fixed field extraction rules cannot be used. Additionally, data must be strongly associated with wafer batches. Deployment requires configuring batch-level data association logic to prevent mixed batch risks.

Configuration settings

The following configuration items are based on FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
MONGODB_URILocal private cluster connection string, or address of an offline-deployed local MongoDB instanceData volume for this category grows rapidly with production batches, requiring high concurrent read/write capabilities. Local deployment avoids public network dependencies
REDIS_URLLocal Redis instance address, with memory quota set to 4096 MBCaching of wafer batch association data and real-time test results is required. This quota can meet caching needs for thousands of daily batches, and can be adjusted based on actual measurements
STORAGE_S3_ENDPOINTLocal object storage endpoint, such as a MinIO deployment addressLarge files such as wafer incoming material drawings and X-ray inspection images need to be stored. Local deployment avoids public network bandwidth restrictions
DB_MAX_LINK600–800Packaging and testing factories have numerous multi-device data synchronization requests. This value balances concurrent connections and resource usage
FILE_TOKEN_KEYCustom 32-character random stringSecure access tokens must be generated for uploaded process documents and exception reports to prevent unauthorized access
FE_DOMAINFrontend access domain name or IP:port for local deploymentUnified frontend and backend interaction addresses are required to ensure normal document loading and interface calls

Three common configuration mistakes

  • Phenomenon: Uploaded wafer incoming material drawings and X-ray inspection images fail to load after deployment, and the interface displays a 404 error. Cause: STORAGE_S3_ENDPOINT is not correctly configured to point to the local object storage, or access permissions for the storage port are not enabled.
  • Phenomenon: SSO authentication fails after local deployment, with a prompt that authentication parameters do not match. Cause: FE_DOMAIN is not configured as the domain name trusted by the SSO service, or the SSO callback address is not configured in the system.
  • Phenomenon: A request error is prompted when clicking model testing after offline deployment, and curl testing for reranking models fails. Cause: The reranking model image is not deployed locally, or the local port for model calls is not correctly configured, causing the system to fail to locate the model service.

How to verify correct configuration

  • Run a curl command to test the database connection corresponding to MONGODB_URI, and confirm that a normal connection status is returned.
  • Upload a packaging process card document, and verify that the access token generated via FILE_TOKEN_KEY can normally access the document content.
  • Check the memory usage of the Redis instance corresponding to REDIS_URL, and confirm that no cache data overflow occurs.
  • Access the frontend address corresponding to FE_DOMAIN, and verify that the upload and preview functions for process documents and exception reports work normally.

The values provided are common starting points and should be measured against the reader's own samples.