What this category of data looks like
This category of data includes packaging flow cards, bonding and molding parameters, wafer incoming material maps, test program versions, yield reports, and failure analysis reports. Data sources include wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM testing equipment, and customer specification requirements. Data is updated per production batch, after each individual chip test, and on a daily basis. Documents include fields such as wafer number, test bin code, parameter thresholds, and failure type. Units cover voltage, current, time, yield values, and similar metrics.
What constraints these characteristics impose on HTTP interfaces and external systems
The multi-source scattered data sources, high-frequency update rhythm, and diverse document structure of this category impose multiple constraints on HTTP interface and external system integration. Data formats output by different devices and systems vary. Interfaces must support multiple data types, including structured parameters and binary detection maps. High-frequency updates require interfaces to support high-frequency calls. Cache durations must match the update rhythm of each batch and each chip to avoid returning outdated data. Field differences across diverse documents are significant. Interfaces must support dynamic adjustment of returned fields based on document types such as packaging flow cards and test program versions. In addition, packaging and testing data is bound to unique identifiers such as wafer ID and production batch. Interfaces must support accurate data retrieval using these identifiers.
How to configure
This page is compatible with FastGPT v4.17.0.
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
Authorization | Bearer ${packaging and testing business interface token}, validity period configured per platform rules | Packaging and testing business interfaces require authentication to prevent unauthorized access to core production data |
variables | Bind wafer ID and production batch number as global variables, value range 1–20 | Packaging and testing data is bound to unique identifiers, and variables must be used to accurately match documents and parameters of the corresponding batch |
responseData | Only return core fields matched by the current Q&A, for example, return bonding temperature and pressure values for bonding parameters | Reduce invalid data transmission, adapting to the large variation in fields across packaging and testing documents |
| Timeout period | 30–60 seconds | Pulling data from packaging and testing equipment may take extended time, avoiding interrupting interface calls midway |
| Document type filter | Filter by classification of packaging flow cards and test program versions | Accurately match the packaging and testing document type corresponding to user questions, improving Q&A accuracy |
| Batch recall limit | Top 5–10 entries | The volume of single-batch packaging and testing data is limited. Excessive returns will increase transmission burden |
Three common configuration errors
- Symptom: The interface returns
403 This token does not have permission to use the model, or the interface authentication failure prompt indicates no permission. Cause: The exclusive token of the packaging and testing business interface is not configured in theAuthorizationparameter, or the token permission does not cover the retrieval permission of the corresponding document type. - Symptom: The
responseDatafield returned by the interface is empty, or no matching packaging and testing document is found. Cause: Thevariablesare not configured to bind the correct wafer ID or production batch number, causing the interface to retrieve data from unrelated batches. - Symptom: Interface call times out, or returned data is incomplete. Cause: The timeout period is configured too short, not matching the actual time required to pull data from packaging and testing equipment, or not filtering by document type resulting in excessive returned data volume.
How to confirm the configuration is correct
- Call the configured test interface, check the returned authentication status, confirm that the token configured in the
Authorizationparameter is valid and its permissions cover the target packaging and testing document type. - Enter a test question bound to a known wafer ID or production batch number, check whether the fields returned by
responseDatamatch the corresponding packaging flow card or test program version. - Simulate high-frequency calls to verify that the interface can normally return data under the update rhythm after each production batch and each chip test.
- Adjust the interface call duration to more than 30 seconds, confirm that the call process is not interrupted due to timeout.
The values provided here are common starting points and should be measured against the reader's own samples.