Process Specification and Technical Standard Q&A for Semiconductor Packaging and Testing: Tool Calling and Plugins

The data for this category primarily comes from wafer test maps, manufacturing execution systems (MES), bonding and molding equipment, ATE test

What Data Looks Like for This Category

The data for this category primarily comes from wafer test maps, manufacturing execution systems (MES), bonding and molding equipment, ATE test machines, X-ray/SAM inspection equipment, and customer specification requirements. Daily documents include packaging process cards, bonding and molding parameter tables, incoming wafer maps, test program version files, yield reports, and failure analysis reports. Update frequency follows per production batch, after each individual chip test, and daily updates. Document fields include equipment parameter thresholds, test bin codes, failure type identifiers, and units such as newtons, degrees Celsius, milliseconds, and other professional industrial parameter units.

Constraints Imposed on Tool Calling and Plugins Workflow

Data sources are scattered and update frequency is high. Tool calling must interface with multiple types of equipment and the MES system, and adapt to different document parsing formats. Field differences across documents are significant. For example, coordinate fields in incoming wafer maps and bin code fields in test programs have distinct formats. Plugins must support custom field mapping. Data volume per update fluctuates with production batches. Dynamic context length configuration is required to adapt to these changes. Failure analysis reports contain a large number of professional terms. Tool calling must support accurate recall of industry-specific terms to avoid ambiguity. Additionally, fine-grained data from per-chip testing requires plugins to control context scale during processing to prevent overflow.

Configuration Settings

This configuration is adapted for FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
Question OptimizationEnable and prioritize packaging and testing industry terminologyAdapt to the professional terminology system of this category and improve document recall matching accuracy
Single Search LimitTop 8 entriesCover core information across multi-field documents for this category, calibrated based on actual testing
Maximum Context8000–12000 charactersAdapt to the total length of single-batch production documents and test reports, avoid context overflow
Workflow/API tool selectionAutoAllow the model to independently select appropriate tools, covering multiple needs such as process query and parameter calling
Streaming Output FilteringEnable and configure process violation keyword rulesFilter parameter outputs that do not meet production requirements, corresponding to compliance needs for this scenario
Document Parsing PluginSelect a PDF parsing plugin that supports structured field extractionAdapt to documents with structured fields such as packaging process cards and yield reports

Three Common Misconfigurations

  • Symptom: Unfiltered non-compliant process parameters appear during streaming output, and the output content does not meet production specifications. Cause: Streaming output filtering rules are not configured, or the rules do not cover exclusive violation keywords for this category.
  • Symptom: Coordinate fields from incoming wafer maps cannot be extracted when calling a PDF parsing plugin, resulting in empty parsing results. Cause: The selected parsing plugin does not adapt to the structured field format of semiconductor packaging and testing documents, with no special adaptation for wafer map coordinates.
  • Symptom: Authorization limit errors are triggered when using the open-source version of FastGPT as a commercial backend service. Cause: Authorization requirements for using the open-source version in commercial scenarios are not clarified, and non-compliant plugins are deployed directly.

How to Verify Proper Configuration

  • Submit a test question that includes a query for incoming wafer map coordinates, and check whether the corresponding document parsing plugin is triggered in the tool calling log.
  • After configuring streaming output filtering rules, input a test question containing non-compliant process parameters, and confirm that the output content has been filtered.
  • Upload a single batch of packaging process cards and test program version files, and verify that the number of recalled documents matches the single search limit setting.
  • Set toolChoice to Auto, input a query for bonding parameters, and confirm that the model automatically triggers the appropriate tool calling.

Note: The configuration values listed above are common starting points and should be evaluated against the reader's own samples.