What This Category of Data Entails
Semiconductor packaging and testing scenario data includes packaging process cards, bonding and molding parameters, wafer incoming material maps, test program versions, yield reports, failure analysis reports, and more. Data sources include wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM detection equipment, and customer specification requirements. Data update frequency adjusts based on production batches, single-chip test results, and daily production progress. Each document includes clear fields such as batch number, parameter thresholds, test bin values, and failure types. Units include voltage, current, time, yield percentage, and more.
Constraints Imposed on Tool Calling and Plugins
This category of data is multi-source and heterogeneous, originating from equipment, systems, and customer specifications. Tool calling must adapt to different interface formats and data structures. The high-frequency update feature requires plugins to pull the latest batch data on demand. This prevents use of expired packaging parameters or test programs. Multiple document types require tools to parse content in varied formats, including wafer incoming material maps, parameter tables, and failure analysis reports. Core alignment steps between wafer maps and physical batches require tools to associate batch numbers with corresponding document fields. This ensures correct production data is matched during calls. Errors may lead to production issues such as mixed batches or packaging failures. Tool calling must add verification steps to block incorrect data from entering the review process.
Configuration Settings
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
| Workflow/API function-call configuration | Enable forced structured calling | Ensure tool calls return structured data matching production document formats, to support cross-verification of technical documents |
| Workflow/API tool selection | Fixed binding to dedicated packaging and testing plugins | Avoid irrelevant plugin calls, focus on acquiring core production data such as wafer incoming materials and bonding parameters |
| Single plugin call timeout | 45 seconds (based on actual measurement) | Adapt to data return cycles of ATE test machines and X-ray equipment, balance response speed and call stability |
| Maximum recalled associated documents | Top 6 entries | Cover core documents for a single production batch, including process cards, test programs, and yield reports. Prevents redundant data from interfering with reviews |
| Result field verification | Match batch numbers and test bin values | Ensure returned data fully corresponds to the current review production batch and test items, reduce cross-batch data confusion |
This document was written based on FastGPT v4.17.0
Three Common Configuration Errors
- Phenomenon: The interface address returned after plugin calls uses the default sample address. Real data from in-house packaging and testing equipment cannot be pulled. Cause: The domain name and port of the target API were not modified in the plugin configuration. The preset placeholder address api.example.com remains in use.
- Phenomenon: A 500 error returns when calling the document update interface via API, but normal operation works via the browser. Cause: Correct authentication parameters are not included, or the API call request header does not match FastGPT backend verification rules.
- Phenomenon: After uploading documents such as packaging process cards, calling related content during deployment questions cannot retrieve the corresponding documents. Cause: The configuration for triggering plugins via document association is not enabled, or chunking rules do not cover deployment-related document paragraphs.
How to Verify Correct Configuration
- Trigger a test request for technical document cross-review. Check the plugin call log to confirm the bound dedicated packaging and testing plugin was called.
- Review the data returned by the plugin. Confirm it includes core content such as wafer incoming material map parameters and bonding process parameters for the current review batch.
- Validate the API call interface request and response. Confirm production document data can be pulled or updated normally.
- Upload a test packaging process card. Ask about related process requirements, confirm returned content originates from the uploaded document.
The values provided are common starting points and should be evaluated against applicable operational samples.