What the data for this category looks like
Semiconductor packaging and testing business data comes from wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM testing equipment, and customer specification documents. Data update frequencies cover per batch, per tested die, and daily. Daily generated documents include packaging process cards, bonding and molding parameter tables, incoming wafer maps, test program version files, yield reports, and failure analysis reports. Data fields include batch numbers, equipment operating parameters, test bin codes, yield values, and more. Corresponding units include degrees Celsius, hours, batch identifiers, and more.
Constraints on Tool Calling and Plugins From These Data Characteristics
Multi-source heterogeneous data sources require tool calling to support integration with different device interfaces and document formats. This prevents single tools from covering full-process data. High-frequency update cycles require plugin calls to support real-time or near-real-time data pulling. This ensures bid documents and quotations stay timely. Structured parameters in professional documents require tools to adapt to the specific layout of industrial PDFs. This allows accurate extraction of core fields such as bonding temperature and molding pressure. Alignment requirements between batches and wafer maps require tool calling to support field matching logic. This ensures data is correctly bound to corresponding batches.
Configuration Settings
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
| Workflow/API tool selection | Auto | Adapts to mixed calling scenarios of multi-source device data and professional documents |
| Workflow/API function-call configuration | Enabled | Supports calling dedicated plugins for packaging parameter extraction, yield statistics, bin distribution analysis, and other tasks |
| Single search limit | Top 8 entries | Matches the number of core data entries for single-batch wafer testing |
| Context window | 7000–9000 token | Carries the full content of packaging process cards and customer specification documents |
| Cache validity period | 12 hours | Matches the daily update rhythm of yield reports and batch data |
Three Common Mistakes
- After parsing packaging process card PDFs, core parameters such as bonding temperature and molding pressure are missing from the output Markdown. This occurs when only general conversion tools are used, without specifying a dedicated parsing plugin adapted to industrial documents, leading to failure to correctly extract professional fields.
- When calling the knowledge base, the number of returned reference entries is insufficient to support complete quotation calculations. This happens when the search limit configuration is not adjusted based on the data volume of single-batch wafer testing, resulting in unavailable reference data that does not cover all valid content.
- Connection timeout errors occur when calling a locally deployed large language model. This is caused by incorrect configuration of the local model's interface address and port parameters, preventing the tool from establishing a valid connection.
How to Confirm the Configuration Is Correct
- Upload a test packaging process card PDF, and check whether the parsed Markdown content includes core parameters such as bonding temperature and molding pressure.
- Initiate a query containing single-batch test data, and check whether the number of returned reference entries matches the configured single search limit.
- Use the tool calling panel in FastGPT v4.17.0 to attempt calling the interface of a locally deployed large language model, and check whether the returned response is normal.
- View the tool calling logs, and confirm that
functionCalltriggers dedicated plugins for yield statistics or bin distribution analysis.
The values provided here are common starting points, and should be measured against the reader's own samples.