Bid Document and Quotation Preparation for Semiconductor Packaging and Testing: Forms and Interactions

Core data for this category includes packaging process cards, bonding and molding parameters, wafer incoming material drawings, test program versions

What the Data for This Category Looks Like

Core data for this category includes packaging process cards, bonding and molding parameters, wafer incoming material drawings, test program versions, yield reports, and failure analysis reports. Data is primarily sourced from wafer test maps, MES systems, bonding and molding equipment, ATE testers, X-ray/SAM inspection equipment, and customer specification requirements. Update frequencies cover per batch of materials, per chip test, and daily synchronization. Fields include wafer batch number, test bin value, yield percentage, equipment parameter thresholds, and more. The corresponding relationship between physical batches and wafer maps must be matched.

Multi-source heterogeneous data sources require forms to support multi-format file uploads, and to match the associated fields of wafer maps and batches. High-frequency updated data requires forms to support real-time synchronization of the latest parameters from MES and testers, to avoid using expired data for bid quotation preparation. Complex business fields such as bin distribution and failure type require custom form components to reduce manual entry errors. Cross-link document association requires forms to support multi-file binding and version tracing, and to restrict unauthorized users from modifying core parameter fields. The formInput component must be used to bind core business fields, and the userSelect component to limit the optional range of business parameters, ensuring that the interaction process conforms to business logic.

Configuration Settings

Configuration settings are based on FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
Default file upload formatsSupport CAD, PNG, CSV formats, with all uploadable formats checked by defaultThis category requires uploading multi-format files such as wafer incoming material drawings and test data reports. Selecting all formats by default simplifies the MCP docking process
formInput field validationBind wafer batch number and test program version fields, set required validationBid quotations must accurately match batches and test programs to avoid the risk of mixed batches or incorrect programs
userSelect option presetPreset bin distribution interval and yield threshold options, with a range of 80%-99%The yield of semiconductor packaging and testing conforms to the conventional industry range, and narrowing the optional range reduces entry errors
Form submission timeout30 secondsEnsure quick verification of the matching relationship between multiple files and fields, avoiding long waiting times
Knowledge base association triggerLoad corresponding quotation template fields after selecting packaging typeQuotation fields vary by packaging type, and on-demand loading simplifies the interaction process

Three Common Misconfigurations

  • Phenomenon: Format incompatibility error occurs during file upload, and industry files cannot be automatically identified when docking with MCP. Cause: The default file upload format is not set to cover all supported semiconductor industry file types, only some commonly used formats are checked.
  • Phenomenon: Empty error occurs when calling the model accessed via OneAPI, and the interface displays invalid key. Cause: The OneAPI API address and corresponding key are not correctly configured in the platform, only a universal token is entered without binding a specific model.
  • Phenomenon: The code running node cannot retrieve the first search result of the knowledge base. Cause: The knowledge base recall parameter is not configured in the node, or the number of returned recall results is not specified.

How to Confirm Proper Configuration

  • Upload wafer incoming material drawings and test program version files, check whether the preset uploadable format list is automatically matched.
  • Fill in the wafer batch number and test program version fields, verify that the required validation triggers normally.
  • Select the packaging type, check whether the quotation template fields for the corresponding packaging are loaded.
  • Initiate a knowledge question and answer, verify that the bound knowledge base and model can be called normally.

The values given are common starting points and should be measured against the reader's own samples.