Bid Document and Quotation Preparation for Semiconductor Packaging and Testing: Deployment and Upgrade

Core data for this category comes from wafer test maps, MES systems, bonding and molding equipment logs, ATE tester outputs, X-ray/SAM test results

What the data for this category looks like

Core data for this category comes from wafer test maps, MES systems, bonding and molding equipment logs, ATE tester outputs, X-ray/SAM test results, and customer specification requirements. Daily processed documents include packaging process cards, bonding and molding parameter sheets, wafer incoming material maps, test program version files, yield reports, and failure analysis reports. Data is updated daily in sync with production batches and individual test results. Document fields include wafer IDs, bonding temperature parameters, test bin codes, yield values, and more. Units include degrees Celsius, volts, and others.

What constraints these characteristics impose during deployment and upgrade

Data sources include multiple types of industrial equipment and real-time production systems. Deployment must support multi-protocol data access and high-frequency, small-batch data synchronization. Document structures vary significantly. Flexible document parsing rules must be configured to adapt to files in different formats, such as packaging process cards and test bin distribution reports. Data is updated daily in sync with production batches and individual test results. Deployment must reserve sufficient concurrent processing capacity to avoid data synchronization delays that impact bid quotation timeliness. Bid documents must strictly align with customer specifications and production data. Data verification rules must be configured to ensure consistency of core fields such as wafer IDs and test parameters, preventing issues including mixed batches or incorrect program usage.

How to set configurations

These configurations are based on FastGPT v4.17.0.

Configuration ItemRecommended SettingRationale
MONGODB_URImongodb://username:password@host:27017/fastgpt?authSource=adminAdapts to bulk storage requirements for multiple documents in semiconductor packaging and testing; the default port 27017 is a widely used MongoDB port in the industry
REDIS_URLredis://:password@host:6379/0Used to cache frequently accessed test parameters and wafer data; the default port 6379 is suitable for industrial deployment scenarios
DB_MAX_LINK50–80Matches the concurrent read volume of each production batch, preventing database connection exhaustion
STORAGE_S3_ENDPOINTFill in according to the enterprise's self-built object storage addressUsed to store large-volume documents such as packaging process cards and failure analysis reports, adapting to multi-node access requirements
FE_DOMAINFill in according to the public network domain name of the deployment serverUsed to generate accessible links for bid documents, ensuring customers can view complete document attachments

Three common errors

  • Symptom: Containers fail to start after deployment, with logs indicating mismatched image architecture. Cause: The appropriate ARM-compatible image was not pulled, and the AMD architecture image file was used directly.
  • Symptom: The document parsing module fails to load, with the interface prompting missing dependencies. Cause: Only the MongoDB and vector database images were started, and the sandbox container was not launched, causing the document parsing function to operate abnormally.
  • Symptom: Calling the getPluginGroups interface returns a 500 status code, with the interface prompting that the commercial version link is not configured. Cause: The ROOT_KEY parameter was not correctly configured during open-source version deployment, or the initialization code dependent on the commercial version was not removed, leading to interface verification failure.

How to confirm the configuration is complete

  • Run the database connection test script to verify the connection status of MONGODB_URI and REDIS_URL, and confirm that the number of connections does not exceed the DB_MAX_LINK configuration value.
  • Upload a packaging process card document, check if the parsed fields include core information such as bonding temperature and molding parameters, and confirm that the parsing rules adapt to the category's document structure.
  • Access the address bound to FE_DOMAIN, verify that the front-end page loads normally and displays uploaded document attachments.
  • Simulate submitting a batch of test data, confirm that the system can automatically synchronize production batch information without data delay errors.

The values provided here are common starting points and should be evaluated against the reader's own samples.