Inspection and Process Record Audit for Semiconductor Packaging and Testing: Tool Calling and Plugins

This category of data covers records related to the entire packaging process. Daily documents include packaging process cards, bonding and molding

What this category of data looks like

This category of data covers records related to the entire packaging process. Daily documents include packaging process cards, bonding and molding parameter tables, wafer incoming material diagrams, test program version files, yield reports, and failure analysis reports. Data sources include wafer test charts, factory MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM testing equipment, and customer specification requirements. Data is updated according to production batches, single-chip test results, and daily summary rhythms. Each single record includes fields such as batch number, parameter thresholds, test bin values, and failure types. The structure adjusts based on inspection items, with no unified fixed length.

The multi-source and heterogeneous data characteristics of this category require tool calling plugins to adapt to the interface formats of different data sources such as MES systems, ATE test machines, and X-ray testing equipment. The high-frequency updated business rhythm requires plugins to support data pulling triggered by production batches or single test results, to avoid data lag. The diverse document types require plugins to parse structured parameter tables, visual wafer diagrams, and text-based failure analysis reports, adapting to different field extraction needs. The core process of associating wafer diagrams with physical batches requires plugins to establish cross-data source association mapping through batch numbers, reducing manual alignment costs.

How to set the configuration

Configuration ItemRecommended SettingRationale
Workflow/API tool selectionautoAdapt to the plugin calling needs of multiple data sources, automatically match the corresponding tool to process different types of business data
Workflow/API function-call configurationTriggered by production batchThis category of data is updated according to production batches. Triggering by batch ensures data integrity and avoids repeated calls for single-chip data
Plugin timeout threshold300–600 secondsData pulling from ATE test machines and MES systems requires cross-device interaction. The timeout threshold must cover the normal time range of device response, calibrated based on actual measurements
Maximum number of pulled data recordsTop 200 recordsThe test data volume of a single batch production is usually in the hundreds. Setting the upper limit to 200 covers conventional batch scales and avoids invalid data overload
Plugin result output formatStructured JSONThe model output needs to be converted into a format that can be imported into yield reports. Structured JSON can directly connect to the factory document system without secondary conversion
Cross-domain access permissionAllow 192.168.1.0/24 network segmentInternal equipment and systems of packaging and testing factories are deployed on the intranet. Only allowing intranet IPs to initiate requests ensures data security

Three common mistakes

  • Phenomenon: The database query plugin returns an empty result with a 404 status code. Cause: Cross-domain access permission for the factory intranet IP is not configured, causing the plugin to fail to pull packaging process card data from the MES system.
  • Phenomenon: The document conversion result output by the model is missing bonding parameter fields. Cause: The triggering rule for functionCall is not clearly defined, causing the plugin to fail to extract core fields such as bonding temperature and pressure from the packaging process card.
  • Phenomenon: Plugin calling times out, returning a 504 status code. Cause: The number of pulled ATE test data records exceeds the configured upper limit, causing data processing time to exceed the threshold.

How to confirm the configuration is complete

A simulated production batch plugin call is performed, and whether the wafer incoming material diagram and ATE test data of the corresponding batch can be pulled is verified. Plugin calling logs are reviewed, and it is confirmed that toolChoice automatically matches the plugin for the corresponding data source, with no call failure errors occurring. The results processed by the plugin are exported, and whether all fields required for packaging process cards and yield reports are included is checked, with the format confirmed to meet the import requirements of the factory document system. On the plugin management page of FastGPT v4.17.0, it is confirmed that the cross-domain access IP segment has been configured as the factory intranet network segment.

The values given here are common starting points and should be measured against the reader's own samples.