What This Category’s Data Looks Like
Daily documents for this category include packaging process cards, bonding and molding parameters, wafer incoming material diagrams, test program versions, yield-related reports, and failure analysis reports. Data sources cover wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM detection equipment, and customer specification documents. Data is updated per batch, per individual test result, and on a daily cycle. Documents include fields such as parameter values, batch numbers, test bin codes, failure locations, and others. Some documents include visual charts, with units including voltage, current, time, and other relevant metrics.
Constraints Imposed by These Characteristics on Knowledge Base Retrieval and Recall
Multi-source heterogeneous data sources require field alignment. Associated fields such as batch numbers and test bin codes must be matched to ensure retrieval results are tied to the current production batch. The high-frequency update rhythm requires the retrieval pipeline to support rapid synchronization of latest data, preventing calls to expired packaging parameters or test programs. Visual documents such as wafer incoming material diagrams require adaptation for non-text content parsing, ensuring parameter information linked to charts can be retrieved. Business scenarios with bound multiple documents — such as the association between packaging processes and ATE test program versions — require retrieval to support cross-document associated recall, preventing mismatches between parameters and programs.
How to Configure Settings
The following configurations are adapted for FastGPT v4.17.0.
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
similarity | 0.75–0.85 | Matches the parameter precision requirements of semiconductor packaging and testing, avoiding recall of low-matching documents unrelated to the batch |
limit | Top 8 entries | Covers multiple types of documents involved in a single batch production (process cards, test programs, yield reports, etc.), avoiding excessive results that exceed context limits |
searchMode | fullTextRecall | Adapts to associated matching of multi-source heterogeneous data, supporting cross-field retrieval of core business fields such as batch numbers and test bin codes |
usingReRank | Enabled | Optimizes the sorting accuracy of retrieval results, prioritizing recall of parameters and reports most relevant to the current production scenario |
datasetSearchUsingExtensionQuery | Enabled | Automatically expands retrieval keywords, covering professional terms for multiple types of documents such as packaging process cards and ATE test programs |
collectionIds | Collection IDs bound to production scenarios | Limits the retrieval scope to the document collection corresponding to the current batch, avoiding recall of irrelevant historical batch data |
Three Common Configuration Errors
- Phenomenon: Visual documents including imported wafer incoming material diagrams and X-ray detection diagrams fail to display normally in retrieval results. Cause: Non-text content parsing configuration for the knowledge base is not enabled, or metadata linking images to corresponding parameter files was not correctly configured during document import.
- Phenomenon: Knowledge base retrieval takes longer than 15 seconds, with delayed interface result returns. Cause: Retrieval scope is not limited to the current production batch’s document collection via
collectionIds. Excessive historical batch data is included in retrieval, leading to excessive recall calculation load. - Phenomenon: Retrieval results include test program version documents unrelated to the current production batch. Cause: No
similaritythreshold is set, or the threshold is configured improperly, leading to recall of low-relevance documents with insufficient matching.
How to Confirm Configurations Are Properly Set
- Manually import a single packaging process card document, run targeted keyword retrieval, and verify whether the result includes this document.
- Upload a wafer incoming material diagram with visual charts, retrieve the corresponding batch number, and verify whether the chart loads and displays normally.
- Check system retrieval logs to confirm the retrieval scope only covers the document collection bound to the current production scenario, with no irrelevant historical data included.
- Run batch retrieval tests, and verify that the sorting of returned results aligns with the priority requirements of the business scenario.
All provided configuration values are common starting points and should be validated against local operational data samples.