What the data for this category looks like
PCB manufacturing scenario data comes from customer-delivered Gerber files, drill files, BOMs, as well as CAM system data, production equipment parameters, chemical bath test results, AOI inspection reports, electrical test reports, and laboratory slice reports. Daily documents include engineering production instructions, drilling and lamination parameter records, chemical analysis logs, and more. Data updates are triggered by production batches and shifts. Some equipment data is collected continuously. Fields include professional parameters such as drill hole diameter, lamination temperature, AOI defect location, and electrical test continuity value.
What constraints these characteristics impose on workflow orchestration
Data sources for this category are scattered, covering multi-format content including customer-delivered files, equipment operation logs, and multiple types of inspection reports. Workflow orchestration must support cross-data source pulling and format adaptation. Data update rhythms vary significantly, with three categories: batch-level, shift-level, and real-time collection. Configuration must pull data based on business trigger conditions, rather than using fixed periodic triggers. There are many professional fields, such as drill hole diameter, lamination temperature, AOI defect coordinates, and other exclusive parameters. Workflows must support custom variable binding to corresponding fields to avoid matching errors. At the same time, defect traceability requires associating data across multiple links, so workflows must connect each link node to form a complete end-to-end chain.
How to set the configurations
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
variables | Bind production batch number and Gerber file number as global variables, with no more than 20 passed in a single run | Match associated fields across multiple data sources, avoid cross-node data confusion, and align with the association logic of PCB batch data |
nodeId | Assign a unique identifier to each data source node, sorted according to the production process sequence | Ensure the workflow node execution order matches PCB production procedures, making it easy to quickly locate abnormal links |
| Multi-knowledge base association configuration | Associate the engineering document library, inspection report library, and equipment parameter library at the same time, returning the top 3 matching results per call | Cover the full-link documents required for PCB quality traceability, and avoid missing key process parameters |
| Abnormal node retry threshold | Set to 2 retries, with a 60-second interval between each retry | Address temporary equipment data disconnections or document loading delays, and avoid terminating the entire traceability workflow due to a single anomaly |
| Result verification trigger condition | Trigger manual review when an empty electrical test report field is detected | Electrical test data is the core basis for PCB continuity, and empty values directly affect traceability accuracy |
| Keyword extraction configuration | Extract keywords such as batch number, defect location, and process parameters from documents | Quickly locate abnormally associated data, and adapt to the exclusive retrieval needs of PCB quality traceability |
The configurations on this page are based on FastGPT v4.17.0.
Three Common Configuration Mistakes
- Phenomenon: The global variables set in the workflow cannot be called in downstream nodes, and the logs show that the variable fields are empty. Cause: The scope of the global variables was not configured in the
variablessetting, causing nodes to fail to read the passed parameters. - Phenomenon: The number of retrieval results does not match the configured return limit, or expected process parameter keywords are not extracted. Cause: Keyword extraction rules were not configured for PCB-specific documents, and only general retrieval logic was used, which cannot recognize professional fields such as drill hole diameter and lamination temperature.
- Phenomenon: When trying to pass workflow global variable tokens via the MCP tool, the tool receives empty parameters. Cause: Global variables were not bound to the input parameter configuration of the MCP tool, or the
nodeIdidentifier for the tool node's association relationship was not used correctly.
How to Verify the Configuration Is Correct
- Manually trigger a test workflow, check the node logs, and confirm that the production batch number bound to
variableshas been correctly passed to downstream nodes. - Upload test Gerber files and AOI reports, run the workflow, and check the associated results to confirm that the multi-knowledge base configuration has pulled the corresponding documents.
- Simulate a device data disconnection scenario, and verify whether the abnormal node executes operations according to the configured retry rules.
- Input test text containing PCB professional fields, and confirm that the keyword extraction configuration can recognize the corresponding exclusive parameters.
The values provided are common starting points and should be measured against the reader's own samples.