What Data for This Category Looks Like
Data sources for semiconductor packaging and testing include wafer test maps, MES systems, bonding and molding equipment, ATE test machines, X-ray/SAM inspection equipment, and customer specification documents. Data update frequencies cover per production batch, per chip test, and daily updates. Daily production and analysis documents include packaging process cards, bonding and molding parameter sheets, incoming wafer maps, test program version files, yield reports, and failure analysis reports. Data fields include chip batch numbers, bonding pull force parameters, molding temperature curves, ATE test bin values, X-ray delamination test results, and more. Data formats vary across sources, so unified mapping is required before analysis can proceed.
What Constraints These Characteristics Impose on the "Tool Calling and Plugins" Workflow
Multi-source heterogeneous data sources require tool calling to adapt to different data source protocols. Examples include connecting to HTTP interfaces for MES, dedicated APIs for ATE test machines, and yield data stored in MongoDB. High-frequency update business rhythms require scheduled synchronization plugins. This ensures called data sources use the latest batch of production and test information. Diverse document types and exclusive fields require tool calling parameters to strictly match the field definitions of each data source. This prevents analysis failures caused by field mismatches. Additionally, coordinate information between wafer test maps and physical batches must be aligned. This imposes high precision requirements on tool calling parameters, to avoid mixing data across batches.
Configuration Guidelines
This configuration is based on FastGPT v4.17.0.
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
| Database connection whitelist | Only allow connections to MongoDB and MySQL instances corresponding to MES and ATE test machines | Complies with data storage specifications for semiconductor packaging and testing, prevents unauthorized data source access |
| Workflow/API tool selection | auto | Adapts to business needs for automatic matching of multiple data sources, no manual tool specification required |
| Workflow/API function-call configuration | Enabled | Enables tool calling functionality, supports automatic database queries and plugin triggering |
| Plugin timeout period | 300 seconds | Adapts to average time taken for industrial equipment data to return, prevents call failures due to device response delays |
| Field mapping rules | Calibrated based on actual measurements | Matches exclusive fields of packaging process cards and ATE test data, ensures data alignment precision |
| Maximum matching results | Top 3 entries | Limits the number of returned test data entries, prevents system overload |
Three Common Configuration Errors
- The project fails to start with 400 InternalError.Algo.InvalidParameter: messages with role error. The cause is that the role field in the database connection plugin parameter configuration does not pass valid values as required, and does not match the authentication parameter format for MongoDB connections.
- The email sending plugin fails to trigger normally. The cause is that the SMTP server port and authorization code parameters are not configured, or the plugin is not bound to the business event that completes the defect analysis.
- Tool calling can only connect to preset MongoDB and MySQL instances, and cannot connect to Oracle databases. The cause is that the dedicated Oracle connection plugin and driver parameters are not installed.
How to Confirm Proper Configuration
- View the connection logs of the database connection plugin, confirm that batch data from the MES system and bin value data from the ATE test machine can be pulled normally.
- Trigger a simulated defect analysis request, check whether the email plugin can send emails containing failure analysis reports according to the configuration.
- Call the tool with
toolChoiceset to auto, confirm that it can automatically match corresponding data sources such as packaging process cards and incoming wafer maps. - Check the field mapping configuration, confirm that the coordinate parameters of the wafer test map can be correctly passed to the failure analysis tool.
The values provided here are common starting points, and should be evaluated against the reader's own samples.