What this category of data looks like
Data sources for this category include wafer test maps, MES systems, bonding and molding production equipment, ATE test machines, X-ray/SAM testing equipment, and customer specification documents. Daily generated documents include packaging process cards, bonding and molding process parameter sheets, incoming wafer maps, test program version files, yield reports, and failure analysis reports. Data is updated per production batch, after each chip test, and via daily summary updates. Fields include batch ID, electrical test bin code, process parameter values, test results, and more.
What constraints these characteristics impose on deployment and upgrade
Data sources for this category are scattered and diverse. During deployment, adaptation to multiple industrial device interfaces and existing MES system connections is required, and multi-data source synchronization links must be planned in advance. The high-frequency update rhythm requires adjustment of data pull scheduled task parameters during deployment to avoid resource overload. Diverse document formats and structured test data require configuration of corresponding parsing and storage rules to adapt to indexing requirements for different fields. During upgrade, compatibility with new process parameters and test data fields is required, to avoid existing indexes becoming invalid, while ensuring access permissions for sensitive documents are controllable.
How to set configurations
| Configuration Item | Recommended Setting | Rationale |
|---|---|---|
DB_MAX_LINK | 100–150 connections | Meets concurrent connection requirements for test data of thousands of chips per batch, avoiding connection pool exhaustion |
REDIS_URL | redis://:custom_password@deployment_server_address:6379/1 | Stores frequently updated batch status and temporary test data, adapting to the update frequency of daily and per-chip operations |
STORAGE_S3_ENDPOINT | enterprise-owned object storage service access address | Stores large-volume documents such as wafer test maps and failure analysis reports, supporting storage of multiple types of industrial documents |
FILE_TOKEN_KEY | 32-bit random encrypted string | Encrypts document access tokens, ensuring access security for sensitive documents such as packaging process parameters |
PG_URL | postgresql://database_username:password@deployment_server_address:5432/fastgpt_seal | Stores structured yield reports and test bin distribution data, supporting structured query requirements |
ROOT_KEY | key generated according to enterprise internal security specifications | Configures system administrator permissions, ensuring that modification permissions for core configurations are controllable |
Three Common Mistakes
- Phenomenon: Database initialization errors occur when deploying a local development environment using Docker Compose, or a
timeout of 60000ms exceedederror is triggered when deleting a folder containing a large number of test documents in the knowledge base. Cause: TheDB_MAX_LINKconfiguration is not adjusted to meet the connection requirements of large-volume batch operations, and the database connection pool parameters are set too small, leading to timeouts. - Phenomenon: Partial test data synchronization fails or is delayed when connecting to data sources such as ATE test machines and MES systems. Cause: Appropriate scheduled pull task intervals and retry strategies are not configured based on the high-frequency update rhythm of each chip and each batch.
- Phenomenon: Missing or incorrect identification of key fields occurs when parsing industrial documents such as incoming wafer maps and packaging process cards. Cause: The special format and field naming rules of this category of documents are not adapted to, and targeted parsing templates are not configured.
How to Confirm the Configuration Is Complete
- Perform a batch delete operation on a folder containing a large number of test documents, check whether the timeout error disappears, and adjust the corresponding connection pool parameters based on actual operation time.
- Connect a single production device, verify whether the data synchronization delay meets business requirements, and adjust the scheduled task execution interval.
- Upload typical documents such as incoming wafer maps and failure analysis reports, check whether the parsed fields match the business documents, and adjust the parsing rules.
- Log in to the FastGPT v4.17.0 system backend, check the data source connection status, and confirm that all configured data sources are in normal connection state.
The values provided are common starting points and should be measured against the reader's own samples.